مؤتمر
Ti-based Barrier for Cu Interconnect Applications
| العنوان: | Ti-based Barrier for Cu Interconnect Applications |
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| المؤلفون: | Wu, W., Wu, H.-J., Dixit, G., Shaviv, R., Gao, M., Mountsier, T., Harm, G., Dulkin, A., Fuchigami, N., Kailasam, S. K., Klawuhn, E., Havemann, R. H. |
| المصدر: | 2008 International Interconnect Technology Conference Interconnect Technology Conference, 2008. IITC 2008. International. :202-204 Jun, 2008 |
| Relation: | 2008 International Interconnect Technology Conference - IITC |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424419111 9781424419128 |
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| تدمد: | 2380632X 23806338 |
| DOI: | 10.1109/IITC.2008.4546967 |