مؤتمر
Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect
| العنوان: | Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect |
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| المؤلفون: | Chai, T.C., Xiaowu Zhang, Li, H.Y., Sekhar, V.N., Hnin, W.Y., Thew, M.L., Navas, O.K., Lau, John, Murthy, R., Balakumar, S., Tan, Y.M., Cheng, C.K., Liew, S.L., Chi, D.Z., Zhu, W.H. |
| المصدر: | 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :38-45 May, 2008 |
| Relation: | 2008 58th Electronic Components and Technology Conference (ECTC 2008) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424422302 9781424422319 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2008.4549948 |