مؤتمر
Effects of warpage on fatigue reliability of solder bumps: Experimental and analytical studies
| العنوان: | Effects of warpage on fatigue reliability of solder bumps: Experimental and analytical studies |
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| المؤلفون: | Wei Tan, Ume, I. Charles, Ying Hung, Wu, C. F. Jeff |
| المصدر: | 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :131-138 May, 2008 |
| Relation: | 2008 58th Electronic Components and Technology Conference (ECTC 2008) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424422302 9781424422319 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2008.4549959 |