مؤتمر
Through silicon vias technology for CMOS image sensors packaging
| العنوان: | Through silicon vias technology for CMOS image sensors packaging |
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| المؤلفون: | Henry, D., Jacquet, F., Neyret, M., Baillin, X., Enot, T., Lapras, V., Brunet-Manquat, C., Charbonnier, J., Aventurier, B., Sillon, N. |
| المصدر: | 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :556-562 May, 2008 |
| Relation: | 2008 58th Electronic Components and Technology Conference (ECTC 2008) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424422302 9781424422319 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2008.4550028 |