Analysis of interconnect sensitivity to process variation in 90nm

التفاصيل البيبلوغرافية
العنوان: Analysis of interconnect sensitivity to process variation in 90nm
المؤلفون: Jiang Lifei, Sun Lingling, Zhou Lei
المصدر: 2008 2nd IEEE International Nanoelectronics Conference Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International. :798-801 Mar, 2008
Relation: 2008 2nd IEEE International Nanoelectronics Conference (NEC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424415724
9781424415731
تدمد:21593523
21593531
DOI:10.1109/INEC.2008.4585604