دورية أكاديمية
Packaging and Assembly of 3-D Silicon Stacked Module for Image Sensor Application
| العنوان: | Packaging and Assembly of 3-D Silicon Stacked Module for Image Sensor Application |
|---|---|
| المؤلفون: | Yoon, S. W., Ganesh, V. P., Lim, S. Y. L., Kripesh, V. |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(3):519-526 Aug, 2008 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
|---|---|
| DOI: | 10.1109/TADVP.2008.927826 |