مؤتمر
Microstructural investigation on the interfacial evolution of SnBi/Cu interconnect during reflow and solid-state aging
| العنوان: | Microstructural investigation on the interfacial evolution of SnBi/Cu interconnect during reflow and solid-state aging |
|---|---|
| المؤلفون: | Zhi-Quan Liu, Pan-Ju Shang, Xue-Yong Pang, Jian-Ku Shang |
| المصدر: | 2008 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on. :1-3 Jul, 2008 |
| Relation: | 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424427390 9781424427406 |
|---|---|
| DOI: | 10.1109/ICEPT.2008.4607072 |