مؤتمر
Investigation of thick film electronic packaging materials in dynamic contact with artificial body fluids
| العنوان: | Investigation of thick film electronic packaging materials in dynamic contact with artificial body fluids |
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| المؤلفون: | Beshchasna, N., Engelien, E., Uhlemann, J., Wolter, K.-J. |
| المصدر: | 2008 2nd Electronics System-Integration Technology Conference Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. :253-258 Sep, 2008 |
| Relation: | 2008 2nd Electronics System-Integration Technology Conference (ESTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424428137 9781424428144 |
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| DOI: | 10.1109/ESTC.2008.4684358 |