FEA modeling and DOE analysis for design optimization of 3D-WLP

التفاصيل البيبلوغرافية
العنوان: FEA modeling and DOE analysis for design optimization of 3D-WLP
المؤلفون: Ming-Che Hsieh, Wei Lee
المصدر: 2008 2nd Electronics System-Integration Technology Conference Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. :707-712 Sep, 2008
Relation: 2008 2nd Electronics System-Integration Technology Conference (ESTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424428137
9781424428144
DOI:10.1109/ESTC.2008.4684437