Likelihood of acquisition by private equity fund in semiconductor packaging industry

التفاصيل البيبلوغرافية
العنوان: Likelihood of acquisition by private equity fund in semiconductor packaging industry
المؤلفون: Ho, C. T., Teng, H. C.
المصدر: 2008 IEEE International Conference on Industrial Engineering and Engineering Management Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on. :22-25 Dec, 2008
Relation: 2008 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424426294
9781424426300
تدمد:21573611
2157362X
DOI:10.1109/IEEM.2008.4737825