مؤتمر
Likelihood of acquisition by private equity fund in semiconductor packaging industry
العنوان: | Likelihood of acquisition by private equity fund in semiconductor packaging industry |
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المؤلفون: | Ho, C. T., Teng, H. C. |
المصدر: | 2008 IEEE International Conference on Industrial Engineering and Engineering Management Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on. :22-25 Dec, 2008 |
Relation: | 2008 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781424426294 9781424426300 |
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تدمد: | 21573611 2157362X |
DOI: | 10.1109/IEEM.2008.4737825 |