مؤتمر
Fast-Cure Lid Adhesive Development for Microprocessors
| العنوان: | Fast-Cure Lid Adhesive Development for Microprocessors |
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| المؤلفون: | Keok, Kee-Hean, Too, Sean, Diep, Jacquana, Tat, Quah Hong, Fumihiro, Arai, Le, Kim |
| المصدر: | 2008 10th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th. :885-889 Dec, 2008 |
| Relation: | 2008 10th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424421176 9781424421183 |
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| DOI: | 10.1109/EPTC.2008.4763542 |