مؤتمر
High performance Cu interconnects with damage-less full molecular-pore-stack (MPS) SiOCH for 32nm-node LSIs and beyond
| العنوان: | High performance Cu interconnects with damage-less full molecular-pore-stack (MPS) SiOCH for 32nm-node LSIs and beyond |
|---|---|
| المؤلفون: | Ueki, M., Tagami, M., Ito, F., Kume, I., Yamamoto, H., Kawahara, J., Inoue, N., Hijioka, K., Takeuchi, T., Saito, S., Onodera, T., Furutake, N., Okada, N., Hayashi, Y. |
| المصدر: | 2008 IEEE International Electron Devices Meeting Electron Devices Meeting, 2008. IEDM 2008. IEEE International. :1-4 Dec, 2008 |
| Relation: | 2008 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424423774 9781424423781 |
|---|---|
| تدمد: | 01631918 2156017X |
| DOI: | 10.1109/IEDM.2008.4796767 |