مؤتمر
Glass Microprobe with Embedded Silicon Vias for 3D Integration
| العنوان: | Glass Microprobe with Embedded Silicon Vias for 3D Integration |
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| المؤلفون: | Lin, Chiung-Wen, Chang, Chih-Wei, Lee, Yu-Tao, Chen, Rongshun, Chang, Yen-Chung, Fang, Weileun |
| المصدر: | 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on. :200-203 Jan, 2009 |
| Relation: | 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424429776 9781424429783 |
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| تدمد: | 10846999 |
| DOI: | 10.1109/MEMSYS.2009.4805353 |