دورية أكاديمية
Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging
| العنوان: | Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging |
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| المؤلفون: | Yew, M.-C., Yuan, C. C. A., Wu, C.-J., Hu, D.-C., Yang, W.-K., Chiang, K.-N. |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 32(2):390-398 May, 2009 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
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| DOI: | 10.1109/TADVP.2009.2015673 |