مؤتمر
Design and fabrication of a miniature pressure sensor head using direct bonded ultra-thin silicon wafers
| العنوان: | Design and fabrication of a miniature pressure sensor head using direct bonded ultra-thin silicon wafers |
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| المؤلفون: | Statler, C.E., Olson, E.S., Farmer, K.R., Digges, T.G., Jr. |
| المصدر: | Proceedings of Ninth International Workshop on Micro Electromechanical Systems Micro electro mechanical systems Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on. :239-243 1996 |
| Relation: | Proceedings of Ninth International Workshop on Micro Electromechanical Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780329856 9780780329850 |
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| DOI: | 10.1109/MEMSYS.1996.493987 |