مؤتمر
Chip pad migration is a key component to high performance MCM design
| العنوان: | Chip pad migration is a key component to high performance MCM design |
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| المؤلفون: | Loy, J., Garg, A., Krishnamoorthy, M., McDonald, J. |
| المصدر: | Proceedings of the Sixth Great Lakes Symposium on VLSI VLSI symposium VLSI, 1996. Proceedings., Sixth Great Lakes Symposium on. :96-99 1996 |
| Relation: | Proceedings of the Sixth Great Lakes Symposium on VLSI |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0818675020 9780818675027 |
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| تدمد: | 10661395 |
| DOI: | 10.1109/GLSV.1996.497601 |