مؤتمر
Wafer bonding of Si with dissimilar materials
| العنوان: | Wafer bonding of Si with dissimilar materials |
|---|---|
| المؤلفون: | Tong, Q.-Y., Kidao, G., Tan, T.Y., Gosele, U. |
| المصدر: | Proceedings of 4th International Conference on Solid-State and IC Technology Solid-state and integrated circuit technology Solid-State and Integrated Circuit Technology, 1995 4th International Conference on. :524-526 1995 |
| Relation: | Proceedings of 4th International Conference on Solid-State and IC Technology |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780330625 9780780330627 |
|---|---|
| DOI: | 10.1109/ICSICT.1995.503338 |