مؤتمر
Injection molded solder - A new fine pitch substrate bumping method
| العنوان: | Injection molded solder - A new fine pitch substrate bumping method |
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| المؤلفون: | Nah, Jae-Woong, Gruber, Peter A., Lauro, Paul A., Da-Yuan Shih, Kazushige Toriyama, Yasumitsu Orii, Hirokazu Noma, Toshihiko Nishio |
| المصدر: | 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :61-66 May, 2009 |
| Relation: | 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424444755 9781424444762 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2009.5073997 |