مؤتمر
Comparative electromigration performance of Pb Free flip chip joints with varying board surface condition
| العنوان: | Comparative electromigration performance of Pb Free flip chip joints with varying board surface condition |
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| المؤلفون: | Nicholls, Lou, Darveaux, Robert, Syed, Ahmer, Loo, Shane, Tee, Tong Yan, Wassick, Thomas A., Batchelor, Bill |
| المصدر: | 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :914-921 May, 2009 |
| Relation: | 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424444755 9781424444762 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2009.5074122 |