مؤتمر
Mechanism of electromigration in Au/Al wirebond and its effects
| العنوان: | Mechanism of electromigration in Au/Al wirebond and its effects |
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| المؤلفون: | Zin, E., Michael, N., Kang, S. H., Oh, K.H., Chul, U., Cho, J. S., Moon, J. T., Kim, C.-U. |
| المصدر: | 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :943-947 May, 2009 |
| Relation: | 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424444755 9781424444762 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2009.5074126 |