مؤتمر
Post-dicing particle control for 3D stacked IC integration flows
| العنوان: | Post-dicing particle control for 3D stacked IC integration flows |
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| المؤلفون: | Bearda, Twan, Travaly, Youssef, Wostyn, Kurt, Halder, Sandip, Swinnen, Bart, Molders, Thomas, Varghese, Ivin, Cheng, Paul |
| المصدر: | 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1513-1516 May, 2009 |
| Relation: | 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424444755 9781424444762 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2009.5074213 |