مؤتمر
Highly-reliable molecular-pore-stack (MPS)-SiOCH/Cu interconnects with CoWB metal-cap films
| العنوان: | Highly-reliable molecular-pore-stack (MPS)-SiOCH/Cu interconnects with CoWB metal-cap films |
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| المؤلفون: | Tagami, M., Furutake, N., Inoue, N., Nakazawa, E., Arita, K., Hayashi, Y. |
| المصدر: | 2009 IEEE International Interconnect Technology Conference Interconnect Technology Conference, 2009. IITC 2009. IEEE International. :11-13 Jun, 2009 |
| Relation: | 2009 IEEE International Interconnect Technology Conference - IITC |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424444922 9781424444939 |
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| تدمد: | 2380632X 23806338 |
| DOI: | 10.1109/IITC.2009.5090327 |