مؤتمر
A new criterion for package integrity under solder reflow conditions
| العنوان: | A new criterion for package integrity under solder reflow conditions |
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| المؤلفون: | Nguyen, L.T., Chen, K.L., Schaefer, J., Kuo, A.Y., Slenski, G. |
| المصدر: | 1995 Proceedings. 45th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1995. Proceedings., 45th. :478-490 1995 |
| Relation: | 1995 Proceedings. 45th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780327365 9780780327368 |
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| DOI: | 10.1109/ECTC.1995.515324 |