مؤتمر
Temperature scaling of electromigration threshold product in Cu/low-K interconnects
| العنوان: | Temperature scaling of electromigration threshold product in Cu/low-K interconnects |
|---|---|
| المؤلفون: | Petitprez, E., Doyen, L., Ney, D. |
| المصدر: | 2009 IEEE International Reliability Physics Symposium Reliability Physics Symposium, 2009 IEEE International. :865-868 Apr, 2009 |
| Relation: | 2009 IEEE International Reliability Physics Symposium (IRPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424428885 9781424428892 |
|---|---|
| تدمد: | 15417026 19381891 |
| DOI: | 10.1109/IRPS.2009.5173368 |