دورية أكاديمية
A Nondestructive Method of Extracting the Width and Thickness of Interconnects for a 40-nm Technology
| العنوان: | A Nondestructive Method of Extracting the Width and Thickness of Interconnects for a 40-nm Technology |
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| المؤلفون: | Tang, M.-C., Cheng, C.-C., Wang, M.-F., Chen, D. C., Yeh, C.-S., Yeh, M., Kuo, A., Chien, S.-S. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 56(9):1891-1896 Sep, 2009 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2009.2026833 |