دورية أكاديمية
A Nondestructive Method of Extracting the Width and Thickness of Interconnects for a 40-nm Technology
العنوان: | A Nondestructive Method of Extracting the Width and Thickness of Interconnects for a 40-nm Technology |
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المؤلفون: | Tang, M.-C., Cheng, C.-C., Wang, M.-F., Chen, D. C., Yeh, C.-S., Yeh, M., Kuo, A., Chien, S.-S. |
المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 56(9):1891-1896 Sep, 2009 |
قاعدة البيانات: | IEEE Xplore Digital Library |
تدمد: | 00189383 15579646 |
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DOI: | 10.1109/TED.2009.2026833 |