Integration of InP/InGaAs/InP p-i-n photodiodes on silicon via wafer bonding and hydrogen-induced layer exfoliation

التفاصيل البيبلوغرافية
العنوان: Integration of InP/InGaAs/InP p-i-n photodiodes on silicon via wafer bonding and hydrogen-induced layer exfoliation
المؤلفون: Peng Chen, Ka Ming Wong, Lau, Kei May, Lau, S. S.
المصدر: 2009 14th OptoElectronics and Communications Conference OptoElectronics and Communications Conference, 2009. OECC 2009. 14th. :1-2 Jul, 2009
Relation: 2009 14th OptoElectronics and Communications Conference (OECC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424441020
9781424441037
تدمد:21668884
21668892
DOI:10.1109/OECC.2009.5214562