مؤتمر
High-density build-up wiring boards using conventional printed wiring boards process
العنوان: | High-density build-up wiring boards using conventional printed wiring boards process |
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المؤلفون: | Itaya, S., Miyazawa, H., Morimoto, E., Takahashi, Y., Uno, Y., Nakakuki, K., Igucki, Y. |
المصدر: | Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International. :96-102 1995 |
Relation: | Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780329961 9780780329966 |
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DOI: | 10.1109/IEMT.1995.526099 |