مؤتمر
High-density build-up wiring boards using conventional printed wiring boards process
| العنوان: | High-density build-up wiring boards using conventional printed wiring boards process |
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| المؤلفون: | Itaya, S., Miyazawa, H., Morimoto, E., Takahashi, Y., Uno, Y., Nakakuki, K., Igucki, Y. |
| المصدر: | Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International. :96-102 1995 |
| Relation: | Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780329961 9780780329966 |
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| DOI: | 10.1109/IEMT.1995.526099 |