مؤتمر
Development of ultra-fine pitch ball bonding technology
| العنوان: | Development of ultra-fine pitch ball bonding technology |
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| المؤلفون: | Tatsumi, K., Uno, T., Kitamura, O., Ohno, Y., Katsumata, T., Furusawa, M. |
| المصدر: | Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International. :295-298 1995 |
| Relation: | Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780329961 9780780329966 |
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| DOI: | 10.1109/IEMT.1995.526177 |