مؤتمر
Solder joints reliability with different Cu plating current density in Wafer Level Chip Scale Packaging (WLCSP)
| العنوان: | Solder joints reliability with different Cu plating current density in Wafer Level Chip Scale Packaging (WLCSP) |
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| المؤلفون: | Cao, Kenny, Tan, Kh, Lai, Cm, Zhang, Li |
| المصدر: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. :819-823 Aug, 2009 |
| Relation: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424446582 9781424446599 |
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| DOI: | 10.1109/ICEPT.2009.5270633 |