مؤتمر
3D integration process flow for set-top box application: Description of technology and electrical results
| العنوان: | 3D integration process flow for set-top box application: Description of technology and electrical results |
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| المؤلفون: | Cheramy, S., Charbonnier, J., Henry, D., Astier, A., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Vittu, J. |
| المصدر: | 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-6 Jun, 2009 |
| Relation: | 2009 European Microelectronics and Packaging Conference (EMPC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424447220 9780615298689 |
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