مؤتمر
High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests
العنوان: | High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests |
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المؤلفون: | Tong Hong Wang, Hsuan-Yu Chen, Chang-Chi Lee, Yi-Shao Lai |
المصدر: | 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :465-468 Oct, 2009 |
Relation: | 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781424443413 9781424443420 |
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تدمد: | 21505934 21505942 |
DOI: | 10.1109/IMPACT.2009.5382218 |