High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests

التفاصيل البيبلوغرافية
العنوان: High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests
المؤلفون: Tong Hong Wang, Hsuan-Yu Chen, Chang-Chi Lee, Yi-Shao Lai
المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :465-468 Oct, 2009
Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424443413
9781424443420
تدمد:21505934
21505942
DOI:10.1109/IMPACT.2009.5382218