مؤتمر
High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests
| العنوان: | High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests |
|---|---|
| المؤلفون: | Tong Hong Wang, Hsuan-Yu Chen, Chang-Chi Lee, Yi-Shao Lai |
| المصدر: | 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :465-468 Oct, 2009 |
| Relation: | 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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