مؤتمر
The evaluation of assembly process for package on package components
| العنوان: | The evaluation of assembly process for package on package components |
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| المؤلفون: | Li, K. C., Ku, J.L., Lee, Andrew, Jay CY Huang |
| المصدر: | 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :493-496 Oct, 2009 |
| Relation: | 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424443413 9781424443420 |
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| تدمد: | 21505934 21505942 |
| DOI: | 10.1109/IMPACT.2009.5382226 |