مؤتمر
Micro-alignment technique using 26-/spl mu/m diameter microsolder bumps and its shear strength
العنوان: | Micro-alignment technique using 26-/spl mu/m diameter microsolder bumps and its shear strength |
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المؤلفون: | Tsunetsugu, H., Hayashi, T., Katsura, K. |
المصدر: | Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium Electronic manufacturing technology Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International. :52-55 1995 |
Relation: | Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780336224 9780780336223 |
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DOI: | 10.1109/IEMT.1995.540993 |