Micro-alignment technique using 26-/spl mu/m diameter microsolder bumps and its shear strength

التفاصيل البيبلوغرافية
العنوان:	Micro-alignment technique using 26-/spl mu/m diameter microsolder bumps and its shear strength
المؤلفون:	Tsunetsugu, H., Hayashi, T., Katsura, K.
المصدر:	Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium Electronic manufacturing technology Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International. :52-55 1995
Relation:	Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
ردمك:	0780336224 9780780336223
DOI:	10.1109/IEMT.1995.540993