دورية أكاديمية
Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test
| العنوان: | Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test |
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| المؤلفون: | Chou, C.-Y., Hung, T.-Y., Huang, C.-J., Chiang, K.-N. |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 33(3):681-689 Aug, 2010 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
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| DOI: | 10.1109/TADVP.2010.2042447 |