دورية أكاديمية
A Study of Crack Propagation in Pb-Free Solder Joints
| العنوان: | A Study of Crack Propagation in Pb-Free Solder Joints |
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| المؤلفون: | Caers, J. F. J. M., Zhao, X. J., Wong, E. H., Seah, S. K. W., Selvanayagam, C. S., van Driel, W. D., Owens, N., Leoni, M., Tan, L. C., Eu, P. L., Lai, Y.-S., Yeh, C.-L. |
| المصدر: | IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 33(2):84-90 Apr, 2010 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 1521334X 15580822 |
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| DOI: | 10.1109/TEPM.2009.2039710 |