مؤتمر
Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures
العنوان: | Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures |
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المؤلفون: | Fischer, A. C., Lapisa, M., Roxhed, N., Stemme, G., Niklaus, F. |
المصدر: | 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on. :472-475 Jan, 2010 |
Relation: | 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781424457632 9781424457618 9781424457649 |
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تدمد: | 10846999 |
DOI: | 10.1109/MEMSYS.2010.5442462 |