Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures

التفاصيل البيبلوغرافية
العنوان: Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures
المؤلفون: Fischer, A. C., Lapisa, M., Roxhed, N., Stemme, G., Niklaus, F.
المصدر: 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on. :472-475 Jan, 2010
Relation: 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424457632
9781424457618
9781424457649
تدمد:10846999
DOI:10.1109/MEMSYS.2010.5442462