مؤتمر
Solidification behavior of lead free and tin lead solder bumps
| العنوان: | Solidification behavior of lead free and tin lead solder bumps |
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| المؤلفون: | Darveaux, Robert, Reichman, Corey, Agrawal, Parul |
| المصدر: | 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1442-1447 Jun, 2010 |
| Relation: | 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424464111 9781424464104 9781424464128 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2010.5490808 |