مؤتمر
Development of a microstructurally adaptive unified primary-cumsecondary creep model for SAC387 solder joints
| العنوان: | Development of a microstructurally adaptive unified primary-cumsecondary creep model for SAC387 solder joints |
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| المؤلفون: | Huang, Z., Kumar, P., Dutta, I., Subbarayan, G., Gupta, V., Chan, D., Wen, C. H. |
| المصدر: | 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-8 Jun, 2010 |
| Relation: | 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424453429 9781424453436 |
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| تدمد: | 10879870 |
| DOI: | 10.1109/ITHERM.2010.5501264 |