مؤتمر
Modified brown oxide treatment as an adhesion promoter for copper lead frame in plastic integrated-circuit packages
| العنوان: | Modified brown oxide treatment as an adhesion promoter for copper lead frame in plastic integrated-circuit packages |
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| المؤلفون: | Lewis Chan, Kwan Yiu Fai, Yau Chun Ho |
| المصدر: | 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. :1-6 Nov, 2008 |
| Relation: | 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424433926 9781424433933 |
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| تدمد: | 10898190 |
| DOI: | 10.1109/IEMT.2008.5507775 |