مؤتمر
Etching process scalability and challenges for ULK materials
| العنوان: | Etching process scalability and challenges for ULK materials |
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| المؤلفون: | Chevolleau, T., Posseme, N., David, T., Bouyssou, R., Ducote, J., Bailly, F., Darnon, M., Kodadi, M. El, Besacier, M., Licitra, C., Guillermet, M., Ostrovsky, A., Verove, C., Joubert, O. |
| المصدر: | 2010 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2010 International. :1-3 Jun, 2010 |
| Relation: | 2010 IEEE International Interconnect Technology Conference - IITC |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424476763 9781424476770 9781424476787 |
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| تدمد: | 2380632X 23806338 |
| DOI: | 10.1109/IITC.2010.5510735 |