Embedded at-speed testing schemes with low overhead for high speed digital circuits on multi-chip modules

التفاصيل البيبلوغرافية
العنوان: Embedded at-speed testing schemes with low overhead for high speed digital circuits on multi-chip modules
المؤلفون: Maier, C.A., Greub, H., Philhower, B., Steidl, S., Garg, A., Ernest, M., Carlough, S., Campbell, P., McDonald, J.F.
المصدر: 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon Innovative systems in silicon Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on. :210-216 1996
Relation: 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780336399
9780780336391
تدمد:10632204
DOI:10.1109/ICISS.1996.552428