مؤتمر
A physically-based built-in Spice poly-Si TFT model for circuit simulation and reliability evaluation
العنوان: | A physically-based built-in Spice poly-Si TFT model for circuit simulation and reliability evaluation |
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المؤلفون: | Chung, S.S., Chen, D.C., Cheng, C.T., Yeh, C.F. |
المصدر: | International Electron Devices Meeting. Technical Digest Electron devices Electron Devices Meeting, 1996. IEDM '96., International. :139-142 1996 |
Relation: | International Electron Devices Meeting. Technical Digest |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780333934 9780780333932 |
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تدمد: | 01631918 |
DOI: | 10.1109/IEDM.1996.553140 |