مؤتمر
Improved reliability of copper interconnects using alloying
| العنوان: | Improved reliability of copper interconnects using alloying |
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| المؤلفون: | Gambino, Jeffrey P. |
| المصدر: | 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the. :1-7 Jul, 2010 |
| Relation: | 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424455966 9781424455973 9781424455980 |
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| تدمد: | 19461542 19461550 |
| DOI: | 10.1109/IPFA.2010.5532242 |