مؤتمر
Improved reliability of copper interconnects using alloying
العنوان: | Improved reliability of copper interconnects using alloying |
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المؤلفون: | Gambino, Jeffrey P. |
المصدر: | 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the. :1-7 Jul, 2010 |
Relation: | 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781424455966 9781424455973 9781424455980 |
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تدمد: | 19461542 19461550 |
DOI: | 10.1109/IPFA.2010.5532242 |