مؤتمر
Stress analysis of Cu pad/solder interfaces
| العنوان: | Stress analysis of Cu pad/solder interfaces |
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| المؤلفون: | Wang, Zhuoru, Qin, Fei, Xia, Guofeng |
| المصدر: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :515-519 Aug, 2010 |
| Relation: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424481408 9781424481415 9781424481422 |
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| DOI: | 10.1109/ICEPT.2010.5582668 |