مؤتمر
Thermal-aware reliability analysis of nanometer designs
العنوان: | Thermal-aware reliability analysis of nanometer designs |
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المؤلفون: | Krishnamoorthy, Srini, Venkatraman, Vishak, Apanovich, Yuri, Burd, Thomas, Daga, Anand |
المصدر: | 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on. :277-280 Oct, 2010 |
Relation: | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781424468669 9781424468652 9781424468676 |
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تدمد: | 21654107 21654115 |
DOI: | 10.1109/EPEPS.2010.5642793 |