دورية أكاديمية
Process Development and Reliability of Microbumps
| العنوان: | Process Development and Reliability of Microbumps |
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| المؤلفون: | Lim, S. P.-S., Rao, V. S., Hnin, W. Y., Ching, W. L., Kripesh, V., Lee, C., Lau, J., Milla, J., Fenner, A. |
| المصدر: | IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(4):747-753 Dec, 2010 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213331 15579972 |
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| DOI: | 10.1109/TCAPT.2010.2046487 |