مؤتمر
Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices
العنوان: | Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices |
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المؤلفون: | Haksoo Han, Hyunsoo Chung, Sungkook Park, Yungil Joe, Sungsoo Park, Gwanchong Joo, Nam Hwang, Hee Tae Lee, Kang Seungoo, Song Min-Kyu |
المصدر: | Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Circuits and systems, Asia Pacific conference Circuits and Systems, 1996., IEEE Asia Pacific Conference on. :421-424 1996 |
Relation: | Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780337026 9780780337022 |
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DOI: | 10.1109/APCAS.1996.569305 |