مؤتمر
Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices
| العنوان: | Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices |
|---|---|
| المؤلفون: | Haksoo Han, Hyunsoo Chung, Sungkook Park, Yungil Joe, Sungsoo Park, Gwanchong Joo, Nam Hwang, Hee Tae Lee, Kang Seungoo, Song Min-Kyu |
| المصدر: | Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems Circuits and systems, Asia Pacific conference Circuits and Systems, 1996., IEEE Asia Pacific Conference on. :421-424 1996 |
| Relation: | Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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